Thick film technology

There is a long tradition in thick film printing in ELCERAM. Printed films are dried in tunnel dryers and fired in tunnel furnaces at temperatures up to 1000 °C. ELCERAM can offer working out production data in standard and non-standard formats, designing and producing screen printing master patterns and screens. ELCERAM offers production even of non-standard series of special thick film resistors. Technological parameters of thick film production comply with demanding requirements of the current market.


Currently used substrate materials 96 % Al2O3, 99,9 % Al2O3, AlN, Al, glass
Max. substrate dimensions 200 mm x 200 mm
Typical substrate thickness 0.1 mm - 1.5 mm
Materials Ag, AgPt, AgPd Au, Pt, Cu, resistive, dielectic
Min. conductor width 50 μm (100 μm for high power applications)
Max. thicknessof conductive layer 20 μm (300 μm for high power applications)
Min. diameter of metallised through holes 100 μm