Thick film technology
There is a long tradition in thick film printing in ELCERAM. Printed films are dried in tunnel dryers and fired in tunnel furnaces at temperatures up to 1000 °C. ELCERAM can offer working out production data in standard and non-standard formats, designing and producing screen printing master patterns and screens. ELCERAM offers production even of non-standard series of special thick film resistors. Technological parameters of thick film production comply with demanding requirements of the current market.
| Currently used substrate materials | 96 % Al2O3, 99,9 % Al2O3, AlN, Al, glass |
| Max. substrate dimensions | 200 mm x 200 mm |
| Typical substrate thickness | 0.1 mm - 1.5 mm |
| Materials | Ag, AgPt, AgPd Au, Pt, Cu, resistive, dielectic |
| Min. conductor width | 50 μm (100 μm for high power applications) |
| Max. thicknessof conductive layer | 20 μm (300 μm for high power applications) |
| Min. diameter of metallised through holes | 100 μm |