Elceram - keramické substráty


TPC technology

 

Technology Thick Printed Copper

Description of Thick Printed Copper technology

  • Substrate is made from 96% alumina with thick printed copper (TPC technology)

  • Technology is intended for high-power applications where high heat removal, reliability, mechanical stability and electrical insulation are required

  • It allows die and wire bonding of high power semiconductors (LED, IGBT, MOSFET etc.) directly onto substrate and their integration with other electronic components (active / passive, sensors) and Thick Film Resistors

  • Conductive layers are screen printed and fired in nitrogen atmosphere

  • Thickness can vary from 20 to 300 µm depending on current carying capacity requirement

  • One PCB can have variable conductor thickness

  • Substrate allows soldering / sintering or using of heat conductive glues to fix onto heatsink

Benefits Applications
  • High printing resolution (100 µm line / gap)
  • Additive technology - no etching
  • Excelent heat conductivity
  • High current carrying capacity
  • High mechanical stability and reliability
  • Allows combination of encased and unencased components
  • ENIG surface coating (Ni/Au) is possible
  • Higher immunity against cyclic heat shocks compared to DBC technology
  • Allows conductive fill of vias
  • With screen printed dielectric allows designing of multilayer circuitry
  • Rectifiers
  • Solar modules (conventional or CPV)
  • LED lamps
  • Switching converters
  • Chargers
  • Single or multilayer ceramic PCBs for high reliable applications
  • Automotive applications
  • Aerospace applications
  • Laser systems

   

LED module

3f rectifier with current and temperature sensing

CPV receiver

   

 

Flyer of the TPC technology can be downloaded here.