Elceram - keramické substráty


Technical conditions of production

Technological options - Ceramic substrates

  • Material
Al2O3
  • Substrate dimensions max.
200 mm x 350 mm
  • Substrate thickness min.
0,1 mm
  • Substrate thickness max.
1,27 mm
  • Camber of substrate
0,2 %
  • Ceramic segments
green scored od laser scribed
  • Dimensions tolerance of (sribed ceramic)
+ 0,2 mm \- 0,05 mm

 

 

 

Technological options - Thick film technology

  • Standard used materials
96 % Al2O3, 99 % Al2O3, , ALN, AL, Glass
  • Max. dimension of substrate
200 mm x 200 mm
  • Substrate thickness

0,1 mm - 1,5 mm
  • Layers
 single-layer, double-layer, multilayer
  • Conductive line width min.
0,1 mm
  • Thickness of conductive silver line max.
20 μm
  •  Size of VIAs min.
0,1 mm